+86-755-23247978
aaron@cxcolor.net
Contact us

Tel: +86-755-23247978

MP/WhatsApp:

+86-13760431543

Email: aaron@cxcolor.net

What is COB-LED display

Issuing time:2018-03-27 00:00

1. What is a COB display?


COB and SMD are a kind of LED packaging method, but the difference is that SMD is called surface mount packaging technology, which means that the wick is welded one by one to the PCB board to make a unit board; and COB is to integrate the light emitting chip PCB board is not

soldered one by one like SMD.

hd small pixel pitch led video wall tv studeo.jpg

The COB display is an LED display composed of display modules made using COB technology and is called a COB display.


2. Main features of COB display.


Due to its unique packaging method, the COB display has the following characteristics: mass production, small display pitch, good

luminescence, and good anti-collision and waterproof characteristics.


3. The main difference between COB and smd. SMD light source concept


SMD light source refers to surface-mounted light-emitting diodes, with a large light-emitting angle, up to 120-160 degrees, compared with early plug

in packaging has high efficiency, good precision, low virtual soldering rate, light weight, small size and other advantages.


The concept of COB light source


COB light source means that the chip is directly packaged on the entire substrate, that is, the N chips are integrated and packaged on the inner substrate. It is mainly used to solve the problem of manufacturing high-power LED lights with low-power chips. It can disperse chip heat dissipation, improve light efficiency, and improve the glare effect of LED lights. The COB light flux density is high, the glare is less and the light is softer, and a uniformly distributed light surface is emitted.


The relative advantages of COB are:


Manufacturing efficiency advantage


The production process of COB packaging is basically the same as the traditional SMD production process, and the efficiency of SMD packaging is basically equivalent in the process of solid crystal bonding and wire bonding. The product is much higher, the traditional SMD seal


Installation labor and manufacturing costs account for approximately 15% of the material cost, COB packaging labor and manufacturing costs account for approximately 10% of the material cost, using COB packaging, labor and manufacturing costs can be saved by 5%.




Contact us
Tel: +86-755-23247978
MP/WhatsApp: +86-13760431543
Email: aaron@cxcolor.net
Follow us
Shenzhen Cxcolor Optoelectronics Co., Ltd.
all rights reserved